Silicon Nitride Plates (Si3N4)

           Silicon Nitride Plates (Si3N4)

Silicon nitride has many excellent properties such as high hardness, high strength, small thermal expansion coefficient, good oxidation resistance, good hot corrosion performance, small friction coefficient, small high temperature creep, like lubricated metal surfaces, etc. It has the best comprehensive performance Structural ceramic materials. Compared with other ceramic materials, silicon nitride ceramic materials have obvious advantages. Especially under high temperature conditions, silicon nitride ceramic materials exhibit mechanical properties such as high temperature resistance, chemical inertness to metals, ultra-high hardness, and fracture toughness.

Ceramic substrates are used in semiconductor packaging in the form of ceramic copper-clad laminates. The excellent mechanical properties of silicon nitride ceramic substrates allow them to be coated with thicker metallic copper. In addition, silicon nitride ceramic copper clad laminate also has better ampere capacity. Silicon nitride ceramic is a semiconductor insulating substrate material that combines the best heat dissipation, reliability, and electrical properties.

Global semiconductor device technology is developing towards higher voltage, greater current and greater power density. Silicon nitride ceramic substrate is the substrate material with the best comprehensive performance that combines high thermal conductivity and high reliability. Currently, silicon nitride ceramic substrate products have been used in the hybrid vehicle/pure electric vehicle market. (Excerpted from New Materials Industry)