Ceramic substrate metallization (AMB)

There are several processes for metallizing ceramic substrates, including DPC, DBC, and AMB. Currently, the only process that meets the standards for automotive components is AMB.

Our company's AMB technology combines the high heat dissipation of silicon nitride ceramic substrates with the conductive properties of metals. Using solder, ultra-thick copper foil (up to 0.8mm or more) is hard-soldered onto the silicon nitride substrate at high temperature, giving it high voltage resistance, high heat dissipation and high reliability. It is mainly used in high-power modules that require energy conversion, such as electric vehicles, power generation and charging systems.

Our silicon nitride AMB technology has passed the automotive industry's thermal shock test standard of 3,000 cycles, with copper thickness up to 0.8mm and above. We can also provide customers with comprehensive thick copper etching services that are difficult to achieve in the industry!