Ceramic Substrate Metallization (AMB)

           Ceramic Substrate Metallization (AMB)

 
Ceramic substrate metallization includes DPC, DBC, AMB and other processes. Currently, the only one that meets automotive component standards is the AMB process.

Chander's AMB technology combines the high heat dissipation of silicon nitride ceramic substrates with the conductor properties of metal, using solder to solder ultra-thick copper foil (up to 0.8mm or more) and using high temperature to braze the ultra-thick copper foil onto the silicon nitride substrate. , making it have the characteristics of high voltage resistance, high heat dissipation and high reliability. It is mainly used in high-power modules that require energy conversion, such as electric vehicles, power generation, charging systems, etc.

Chander's AMB technology has passed 3,000 thermal shock test standards in the automotive industry. The copper thickness can be as high as 0.8mm or more. Chander can provide customers with complete thick copper etching services that are difficult to achieve in the industry!